供應(yīng)樂(lè)泰UF3808,UF3811,UF3820,UF3840,UF2822樂(lè)泰原廠膠水供應(yīng) LOCTITE ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.THAWING: 1. Allow container to reach room temperature before use. 2. After removing from the freezer, set the syringes to stand vertically while thawing. 3. DO NOT open the container before contents reach °C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container. 4. DO NOT re-freeze. Once thawed to °C, the 漢高樂(lè)泰膠水\昆山\上海\吳江\廣州\佛山代理銷售處:137\51\13\63\32.陳生 Q.Q/30/22/24/564/ 網(wǎng).址。w.w.w.a.a.l.o.c.t.i.t.e.c.o.m.
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