哈爾濱特博科技有限公司

2英寸藍寶石切割片

2英寸藍寶石研磨片
2英寸藍寶石清洗封裝片

單晶晶體質量指標：

藍寶石晶體純度≥99.996%
藍寶石晶體內沒有散射顆粒、氣泡、無顏色、無包裹物、無多晶、無孿生等現象；藍寶石晶體無小角晶，晶體定向精度小于0.1°

產品規格：

Epi-Ready Sapphire Wafer

Diameter

50.8±0.1mm

Thickness

430±10μm

Orientation

C-plane 0.2°to M-axis ± 0.1°

C-plane 0°to A-axis ± 0.1°

Orientation flat

16.0±1mm

Primary flat location

A-axis ± 0.2°

Front side surface

Epi-Ready Polished

Surface Roughness

Ra＜0.2nm

Back side surface

0.8—1.2μ

TTV

＜10μ

BOW

＜10μ

Package

Clean Room，Nitrogen Atmosphere

研 磨 片

Orientation

C-plane 0.2°to M-axis ±0.1°

C-plane 0°to A-axis ± 0.1°

Diameter

50.8 ± 0.1mm

Thickness

0.49 ± 0.05mm

TTV

15um

Warp

15um

Primary Flat

Length

16.0±1.0mm

Orientation

A-plane±0.2°

Visual appearance

No cracks，pits，edge chipping